PCB Fabrication

An experienced PCB fabrication resource is a key building block for your electronics products. With Sanmina-SCI you get a single EMS provider dedicated to providing better manufacturability and collaboration. By relying on our global infrastructure and technical know-how, manufacturing your product with high quality standards, yet cost effectively, is no longer a challenge.

Whether you need 100 or 100,000 multilayer PCBs, we're right there to do the job and earn your trust. We have the expertise, technology, reputation and geography to ensure cost savings and increase time-to-market.

Our broad range of PCB fabrication options include:

• Up to 60 layers
• Board thickness from 0.015” to 0.500”
• Copper weight from 12 microns (3/8 oz.) to 343 Microns (10 oz.)
• Aspect ratios over 20:1
• Panel sizes up to 31” x 52”
• Large form factor and high-aspect ratio backplanes
• Microvia laser and high-density interconnect (HDI) technologies
• Embedded passives (ZBC™, Buried Capacitance®, Annular Buried Resistance technologies)
• High-performance materials and composites
• Signal-integrity modeling
• High-speed 10Gps leadership through innovative engineering

Innovation. Deep technology. More than 20 PCB patents. Quality. Global footprint. Top-tier customers. As one of the world’s leading EMS providers, we offer intelligent solutions and work closely with you to raise the quality of your products while lowering cost.

Sanmina-SCI PCB Technologies

Buried Capacitance®
With the continuous trend to smaller feature sizes and faster signal speeds, embedded passives are becoming more cost-effective solutions for improved signal integrity.

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Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials
Dicy-cured FR-4 materials have been used for decades to mount electrical components to PCBs.

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Backdrilling and Blind Via Formation
Backplanes and other thick-format boards can endure significant signal integrity (SI) disturbances as a result of the unused portions of through-holes and vias that extend past their last connected layer.

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Dk and Df Studies for Advanced Signal Integrity
When studying dielectric constants (Dk) and dissipation factors (Df), it is critical to use a single scaling system.

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Opti-Via™ Technology for Improved Signal Integrity at High Frequencies
Opti-Vias™ are a family of engineered via structures whose S-parameters have been optimized for high-frequency applications.

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Buried Capacitance® Fabrication List

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Buried Capacitance® Laminator List

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For more information on Sanmina-SCI End-to-End solutions, Inquire Here!