The trend in backpanel manufacturing is to build larger and denser assemblies. The prospect of fabricating and assembling a backplane should not be pursued without first considering the benefits achievable through Sanmina’s complete end-to-end manufacturing capabilities—from design and manufacturing to test and delivery. After all, it’s the backplane that provides the complex signal pathways for the entire system.

To ensure industry-leading, high-speed backplane products, the following test capabilities help deliver superior product quality and service to our customers in North America, Europe and Asia.

Equipment	Test Features
RoBAT
	Total electrical continuity and short coverage Electrical testing of components Very large panel size – 24” x 57” Simultaneous AOI and electrical test coverage Low setup cost Short setup lead time Eeprom programming* Hipot testing* Virtually fixtureless Full monitoring frame design customization and implementation
Testronics
	Full net list electrical testing Electrical testing of components Large panel size – 30” x 24” 20,480 simultaneous probes Eeprom programming* Powered testing* Probes for connector polarization Probes for hardware presence Full test fixture design customization and implementation
Automatic Optical Inspection
	Automatic QC vision test Low setup cost Short setup lead time Fast test time

*Special features found only at Sanmina-SCI.